Power module encapsulation support! Thermosetting material 'Viroglass'
Combines heat dissipation, dielectric strength, and adhesion. It meets high power applications while simultaneously achieving sealing quality and long lifespan.
In power device and module encapsulation, heat dissipation characteristics and insulation performance are emphasized. "Bioglass" enables uniform encapsulation down to fine details due to its high filling and low-pressure moldability. Its design reduces processes, contributing to production efficiency and quality stability in mass production. 【Features】 - Insulation & heat dissipation design - High reliability encapsulation - Low-pressure processing - Fast curing / process reduction - Compatible with module encapsulation *For more details, please refer to the PDF document or feel free to contact us.
- Company：三菱ガス化学ネクスト（旧日本ユピカ） 本社
- Price：Other
